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Steve Mollenkopf Fireside Chat

October 3, 2014

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Fueled by invention at scale, mobile has become the largest technology platform in history. In this CommNexus Headliner, Qualcomm CEO Steve Mollenkopf sits down with IDC Research VP John Jackson to discuss the future of mobile and how it’s reshaping industries, Qualcomm’s leadership role in driving these advances and Steve’s reflections on being CEO after seven months at the helm of the company. To highlight how mobile is impacting adjacent sectors in exciting new ways, Qualcomm Technologies, Inc. Sr. VP Kanwalinder Singh then presents on how mobile is driving the future of the connected car.

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SPEAKERS:
Steven M. Mollenkopf
Chief Executive Officer, Qualcomm Incorporated 
Steve Mollenkopf is chief executive officer of Qualcomm Incorporated. Mollenkopf began his Qualcomm career as an engineer and, for more than 20 years, has helped define and implement Qualcomm’s strategy and technologies. He also serves on the company’s board of directors.
Mollenkopf oversaw Qualcomm’s investment in technologies that propelled smartphones into the mainstream. During his tenure as president and chief operating officer, Qualcomm became a leader in mobile technology, including computing, graphics and multimedia. The Company also extended its 3G and 4G modem leadership position.

Prior to his role as president and COO, Mollenkopf led the Company’s chipset business, overseeing the launch of 4G technology. He helped make Qualcomm the world’s largest mobile chipset supplier and a global leader in LTE technology. He guided QCT through the worldwide expansion of Code Division Multiple Access (CDMA) technology; the introduction of Wideband Code Division Multiple Access (W-CDMA) technology; the launch of 4G/LTE systems; and drove Qualcomm’s technology leadership position in smartphones.

He also spearheaded the Company’s largest acquisition, the $3.1 billion purchase of chipmaker Atheros. The deal helped expand Qualcomm’s business far beyond smartphones, and accelerated the adoption of Qualcomm’s technologies and platforms in new segments.

Mollenkopf is a published IEEE author and holds seven patents in areas such as power estimation and measurement, multi-standard transmitters, and wireless communication transceiver technology. Mollenkopf serves as chairman of the Global Semiconductor Alliance and as a member of the Board of Directors for the Semiconductor Industry Association.

He holds a Bachelor of Science degree in electrical engineering from Virginia Tech and a Master of Science degree in electrical engineering from the University of Michigan.

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John Jackson
Research Vice President, Mobile & Connected Platforms, IDC
John Jackson is Research Vice President, Mobile & Connected Platforms. He is responsible for IDC’s research on content and service distribution strategies across mobile and connected platforms and execution environments. John has spent the past twelve years researching mobile and computing technologies and business strategies. His areas of expertise include application development and delivery platforms, mobile devices, communications semiconductors, operator and channel strategies, network technologies and standards, as well as market forecasting. Prior to joining IDC, John was a Vice President of Research at CCS Insight, a UK-based market research and advisory firm, and before that he led the Yankee Group’s Wireless/Mobile Technologies practice.

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Kanwalinder Singh
Senior Vice President of Business Development, Qualcomm Technologies, Inc.
Kanwalinder Singh is senior vice president of business development for Qualcomm Technologies, Inc. He is responsible for driving Qualcomm’s chipset business in the “Internet of Everything” (IoE) space, with focus on automotive and smart energy. Singh is responsible for QCT’s strategy, relationships and business development in these domains, solutions development with Qualcomm’s chipset customers and partners, and chipset and reference design roadmaps. Under his leadership, QCT has established a leadership position in LTE-based connected car programs and entered the Infotainment space with Snapdragon Automotive Solutions.

Singh joined Qualcomm in 2004 as president of Qualcomm India and South Asia. He was instrumental in creating a focus on emerging markets and enabling affordable wireless broadband devices. 3G auctions in India, which led to HSPA deployments in 2010, was a highlight during his tenure. Under Singh’s leadership, Qualcomm made a winning bid in India’s BWA spectrum auction in 2010 to secure top markets including Delhi and Mumbai, and established LTE TDD as the 4G roadmap for operators in India. He extended Qualcomm’s partnerships beyond operators to the Open Market and private brands in India, and championed commercialization of the CDMA Open Market Handset (OMH) initiative. Singh also developed successful ecosystem relationships and expanded Qualcomm Ventures’ portfolio to India.

Between 2000 and 2004, Singh was chief technical officer with Lucent Technologies India Ltd. Prior to that, he held various technical and managerial positions in Bell Laboratories and other product units during his 11-year tenure at Lucent Technologies in New Jersey.

Singh completed a master’s degree in electrical engineering from Bucknell University, Pennsylvania, USA and Ph.D. coursework in computer and systems engineering at Rensselaer Polytechnic Institute, New York. He is a graduate of the Executive Development Program at Wharton School of Business, Pennsylvania.

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Questions?: Contact Brittany Bjerke at bbjerke@commnexus.org


DATE
:
Friday, October 3rd 2014


TIME:

5:00PM – Registration/Reception/Networking
6:15PM – Program Begins
7:45PM – Program Ends


LOCATION:

qualcomm
Qualcomm Headquarters
Building N, Irwin M. Jacobs Qualcomm Hall

5775 Morehouse Drive, San Diego, CA 92121


Regular Pricing:
 
**(REGISTRATION CLOSES AT 12:00 NOON ON 10/1/14**
$45.00 – Pre-Registration
$50.00 – At-the-Door
FREE – Students & Military

[wc_highlight color=”yellow”]CommNexus Mentor Sponsor Employees Attend FREE![/wc_highlight] [wc_row][wc_column size=”one-fourth” position=”first”]

[wc_box color=”secondary” text_align=”center”]ACCENTURE[/wc_box]

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[wc_box color=”secondary” text_align=”center”]AGILENT TECHNOLOGIES[/wc_box]
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[wc_box color=”secondary” text_align=”center”]BROADCOM[/wc_box]

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[wc_box color=”secondary” text_align=”center”]CAREFUSION[/wc_box]

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[wc_box color=”secondary” text_align=”center”]COOLEY[/wc_box]

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[wc_box color=”secondary” text_align=”center”]D&K ENGINEERING[/wc_box]
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[wc_box color=”secondary” text_align=”center”]DUANE MORRIS[/wc_box]
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[wc_box color=”secondary” text_align=”center”]ECOATM[/wc_box]

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[wc_box color=”secondary” text_align=”center”] ENTROPIC COMMUNICATIONS[/wc_box]
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[wc_box color=”secondary” text_align=”center”]ERNST & YOUNG[/wc_box]
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[wc_box color=”secondary” text_align=”center”]FAIRWAY TECHNOLOGIES[/wc_box]
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[wc_box color=”secondary” text_align=”center”]HP[/wc_box]

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[wc_box color=”secondary” text_align=”center”]HUAWEI[/wc_box]

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[wc_box color=”secondary” text_align=”center”]HUGHES MARINO[/wc_box]
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[wc_box color=”secondary” text_align=”center”]INTERDIGITAL[/wc_box]
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[wc_box color=”secondary” text_align=”center”]INTUIT[/wc_box]

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[wc_box color=”secondary” text_align=”center”]IRVINE COMPANY[/wc_box]

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[wc_box color=”secondary” text_align=”center”]KEYSIGHT TECHNOLOGIES[/wc_box]

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[wc_box color=”secondary” text_align=”center”]LG[/wc_box]

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[wc_box color=”secondary” text_align=”center”]MICROSOFT[/wc_box]

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[wc_box color=”secondary” text_align=”center”]MINTZ LEVIN[/wc_box]

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[wc_box color=”secondary” text_align=”center”]MORRISON FOERSTER[/wc_box]

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[wc_box color=”secondary” text_align=”center”]NORTHERN TRUST[/wc_box]

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[wc_box color=”secondary” text_align=”center”]PEGASUS BUILDING SERVICES[/wc_box]

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[wc_box color=”secondary” text_align=”center”]PEREGRINE SEMICONDUCTOR[/wc_box]
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[wc_box color=”secondary” text_align=”center”]PROCOPIO[/wc_box]

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[wc_box color=”secondary” text_align=”center”]QUALCOMM[/wc_box]

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[wc_box color=”secondary” text_align=”center”]REDIT[/wc_box]

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[wc_box color=”secondary” text_align=”center”]SDGE[/wc_box]

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[wc_box color=”secondary” text_align=”center”]SILANNA SEMICONDUCTOR[/wc_box]

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[wc_box color=”secondary” text_align=”center”]SILICON VALLEY BANK[/wc_box]

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[wc_box color=”secondary” text_align=”center”]SK TELECOM AMERICAS[/wc_box]

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[wc_box color=”secondary” text_align=”center”]SMITH MICRO TECHNOLOGIES[/wc_box]

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[wc_box color=”secondary” text_align=”center”]SOFTCLOUDS[/wc_box]

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[wc_box color=”secondary” text_align=”center”]SONY[/wc_box]

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[wc_box color=”secondary” text_align=”center”]TRINET[/wc_box]

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[wc_box color=”secondary” text_align=”center”]VERIZON[/wc_box]

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[wc_box color=”secondary” text_align=”center”]VIASAT[/wc_box]

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[wc_box color=”secondary” text_align=”center”]WILSON[/wc_box]

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[wc_box color=”secondary” text_align=”center”]ZTE[/wc_box]

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SPONSORED BY:
qualcomm

Details

Date:
October 3, 2014
Event Category: