The Semiconductor SIG Presents…
Front End Integration in the Era of the Smart Phone
“Moore’s Law (not Rory’s) has enabled stunning improvements in chipset integration and the performance of mobile devices. However, the addition of multiple radios and frequency bands present huge challenges to the RF section of the chipset. Qualcomm is working to address both the challenges and opportunities associated with front end integration to bring smaller sized chipsets and high performance devices to market.”
-Steve Mollenkopf, Executive Vice President and Group President, Qualcomm Inc.
The high growth rate of consumer smart phones is driving a surge in mobile data traffic. In an effort to support this demand, operators are expanding capacity by increasing spectrum and moving to higher order modulation schemes. One area, which is significantly impacted by this trend, is the RF section of the cellular handset. The typical response of the cellular component supplier community has been to provide the demanded advances through IC or module integration. The RF section is seeing both a large increase in component count and an increase in component performance requirements.
A panel of industry experts will share their insights into approaches to meet these challenges. The panel will explore the specific areas within the RF Front End, which need technical improvements and or integration.