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Flextronics MarketLink

October 10, 2007

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October 9-10, 2007

 


 

MarketLink a.k.a. High-Tech Speed Dating:

Marketlink pairs local companies with multinational corporations hoping to identify and license new technologies. MarketLink brings parties of mutual interest together by orchestrating an event that will offer selected companies the opportunity to present to technology executives from visiting corporations in a personalized 1-on-1 session. <more>

 

Who Flextronics is:

Flextronics International enables customers’ businesses by designing, building, shipping, and servicing electronics products in the automotive, computing, consumer digital, industrial, infrastructure, medical, and mobile markets.   Our revenues in FY 2007 were $18.9B.  We employ over 140,000 and have operations over 30 countries on four continents.

We provide cost-efficient, high-value added EMS, CDS, and ODM offerings in all our market segments.  Flextronics also provides components such as PCBs, antennas, camera modules, power supply, and TFT displays which can be customized for any application within our segment focus.  Our mechanical capabilities encompass plastics and metal forming across our market segments, for structural and aesthetic applications.

Our global presence provides design and engineering solutions that are vertically integrated with manufacturing, supply chain management, logistics, and component technologies to optimize customer operations by lowering costs and reducing time to market.  These integrated services allow us to design, build, and ship a complete packaged product to our customers’ end users wherever they may be located. <more>

Flextronics Corporate Technology Office
Under the leadership of Nicholas Brathwaite, Chief Technology Officer, Flextronics is focused on developing process/platform technologies and businesses that facilitate our customer’s time to market and profitability.  The group is responsible for sourcing and applying technologies to improve process and design capabilities, securing intellectual property to enable Flextronics and our customers retain a competitive advantage, and incubating innovations that capture new business opportunities for Flextronics.

 

What Flextronics is Looking For:

Flextronics is interested in engaging and partnering with firms in the following arenas for the purposes of extending our capabilities in the stipulated areas:

  • Acoustics (speakers, microphones, & processing)
  • Antenna Technology (for handsets, computing, radios and TVs, cellular BTS)
  • Batteries/Fuel Cells   (portable computing, handsets)
  • Converged Communications (connected home)
  • Displays (components such as backlights, etc)
  • Light Sources (for backlights, flashlamps, projectors)
  • Embedded Passives
  • RF Switches (handsets, BTS)
  • Optics (lenses, mirrors, assembly methods)
  • Packaging (IC, Module)
  • Power Conversion & Management (all segments)
  • RF Power Amplifiers (BTS)
  • Security (connected home, consumer)
  • Sensors (optical, acoustical, motion, E&M, bio, etc.)
  • MEMS (sensors, actuators)
  • Nano-technology applications
  • Plastics & Metal Forming Technology (enclosures)
  • Coating Technology (optics, enclosures)
  • Materials (for electronic packaging, devices, and enclosures)

 

Who Will Be Here From Flextronics:

Mr. Brathwaite and selected technology executives from both corporate and market segments will be in attendance to explore potential partnerships and areas of mutual interest.

Nicholas Brathwaite
Chief Technology Officer

Mr. Brathwaite has led the Flextronics Corporate Technology Group for over a decade.  His career has spans over two decades and includes senior leadership positions at Intel and nChip.  He sits on the board of Photon Dynamics and Power Integrations.  Mr. Brathwaite holds a B.S. in Applied Chemistry, an M.S. in Polymer Engineering, a BSc (Hons) from McMaster University Canada and an MSc from the University of Waterloo, Canada. He has authored more than 50 national and international publications and is an inventor on several key patents in packaging and process platforms.
Martin Fichter
VP, Engineering

Martin Fichter is Vice President Mobile Design and Technology at Flextronics. He is in charge of all ODM design and development projects at Flextronics Mobile and manages Design Centers in China, South Korea, Finland and Sweden. He brings more than 20 years of experience in the communications industry with a focus on wireless handsets. His background in strategic marketing, research and development, and general management enables Martin to analyze technologies and their market impact in a complete and comprehensive way and then drive their implementation all the way to the consumer. Prior to joining Flextronics in May 2005, Martin was Vice President and General Manager, Mobile Devices North America for Siemens Communications, Inc. Martin serves as an Advisor to SoftMax Inc., Quorum System Inc., Sky Mobilemedia Inc. and he represents Flextronics on the Board of Directors of Step Communications.
Moshe Bubil
Senior Director, Engineering
Srinivas Rao
VP, Materials Technology
Sammy Yi
Senior VP, Technology
Gary Fong
Director, Technology & IP

 

Event Host:

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12235 El Camino Real, Suite 200, San Diego, CA 92130

Applications will be reviewed and accepted on a first come first serve basis, so apply early. There are up to 16 spots and 4 standby spots available for 50 minute presentation meetings with Flextronics. Applicants will be notified on a rolling basis if accepted, with the deadline for final notification of acceptance on August 27, 2007.

THE DEADLINE TO SUBMIT YOUR APPLICATION IS:
5:00PM PDT on September 21, 2007

Details

Date:
October 10, 2007
Event Category: